TVI2306A

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OMDS architecture mainboard



TVI2306A





Descriptions

TVI2306A, OMDS architecture mainboard, uses Rockchip quad-core, wide temperature, low-power chip set (RK3188/RK3188p).

    Expanding I/O board according to different customer demand, it can be used in Mobile POS, Advertising Form Factor, Industrial Control and other Industries.


TVI2306A




















Features

- Rockchip RK3188 OMDS, Mali400 MP4 GPU;

- OMDS SODIMM-204pin Interface, High scalability, need to connect carrier board;

- Max 2GB DDR3L & 64GB eMMC onboard;

- Support MIPI-DSI, LVDS & HDMI display;

- Support 2 independent displays;

- Support 2.4G Wi-Fi & 3G/LTE connectivity;

- Android 4.4/5.1 optional;

- SODIMM contains many rich interfaces: I2S/UART/I2C/USB/OTG/SDIO/GPIO/MIPI/

HDMI/LVDS.





TVI2306A

PlatformCPURockchip Cortex-A9, RK3188
CoresQuad-core
Frequency1.6 GHz
MemoryMax. Capacity2 GB(1 GB Optional)
TypeDDR3L
GPUControllerMali400 MP4
Frequency600 MHz
StorageMax. Capacity32 GB(Up to 64 GB)
TypeeMMC
DisplayMIPI-DSIYes, (connect Carrier board)
LVDSYes, (connect Carrier board)
HDMIYes, (connect Carrier board)
Multiple display2 independent displays
CameraDIFYes, (connect Carrier board)
ConnectivityWIFI 2.4G/5G, 802.11 a/b/g/n 
BluetoothBT-V4.0 BLE
LTEYes, (connect Carrier board)
GPS20 channels
AudioI2SYes, (connect Carrier board)
SensorG-sensorYes, (connect Carrier board)
MonitorWatchdog256-level
OMDS InterfaceSODIMM-204 PinDIF1
MIPI_DSI1
HDMI1
LVDS1
USB OTG1
USB2
I2S1
HSUART/UART-11
UART-2/SPI1
I2C5
A+M+G-sensor1
NFC1
SDIO Card1
SDIO WiFi/BT1
GPIO14
Others Sys Ctrl
Power SupplyDC inputDC-in 3.4-5V
EnvironmentOperating Temperature0 ~ 45 
Storage Temperature-20 ~ 65 
Relative Humidity95%
OSWindowsN/A
Android5.1
PCBATechnologyODMS
Dimension67.6 * 50* 3.5 mm
CertificationEMC3C, RoHS


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